MXF-EN30 – Chip Encapsulated Panel

MXF-EN30 – Chip Encapsulated Panel

Particleboard Panels

They are panels produced using largely recyclable chipboard core. Chipboard panels with a density of 690 – 720kg/m³ have a fire resistance of 30 minutes with a B1 fire class. Chipboard panels, which have different options in 23-38mm thickness, ensure low transportation costs as they are lighter.

Usage areas

Usage: Private buildings, public buildings, offices, libraries, banks and museums 600x600x31mm high density particle board panel from top, bottom and sides.

It is encapsulated with 0.50 mm galvanized steel.

Panel

Thickness : 31mm

Panel Weight : 9.10kg / piece / Per Panels

Panel Dimensions / Panel Size: 600mm x 600mm

Panel Core Material: 30mm Chipboard

Density: 680-720kg/m³

Category : Loose lay

Foot Options

Galvanized steel foot with environmentally friendly clear coating

FFH: 5-25mm M14 / M16 Steel Stud

FFH: 250mm

and above are used with belts at system heights

System Performance

Point Load: 4.50kN

Distributed Load / Uniform Load: 11.60kN

Generation

To increase the lateral rigidity of the system

• FFH: Clip-on belt up to 450 mm

• FFH: Screwed belt after 450 mm

Panel Fire Performance

Reaction Class : EN13501/1 Bfl-s1

Strength / Resistance : EN13501/2 REI30r

This panel has the B1 fire reaction class test 13501-1 TSE certificate.

System Acoustic Performance

Air duct insulation (Dnfw) : 52 dB

Impact insulation (Lnfw) : 44 dB

Tanju Anlayan

+905525776639
tanju.anlayan@mextechs.com

Related Products

MXF-CER40 – Chip Ceramic Coated Panel

MXF-CER40 – Chip Ceramic Coated Panel

MXF-HCB30 – Chip HPL Coated Panel

MXF-HCB30 – Chip HPL Coated Panel

MXF-VCB30 – Chip PVC Coated Panel

MXF-VCB30 – Chip PVC Coated Panel

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